| EMMC 5.1 | ||||||
| Part Number | Interface | Package Size | Capacity | Voltage | Temperature | Product Status |
| KLM8G1GEUF-B04P | HS400 | 11.5 x 13 x 0.8 mm | 8 GB | 1.8 / 3.3 V | -40 ~ 95 °C | Mass Production |
| KLM8G1GEUF-B04Q | HS400 | 11.5 x 13 x 0.8 mm | 8 GB | 1.8 / 3.3 V | -40 ~ 105 °C | Mass Production |
| KLM8G1GESD-B04P | HS400 | 11.5 x 13 x 0.8 mm | 8 GB | 1.8 / 3.3 V | -40 ~ 85 °C | EOL |
| KLM8G1GESD-B04Q | HS400 | 11.5 x 13 x 0.8 mm | 8 GB | 1.8 / 3.3 V | -40 ~ 105 °C | EOL |
| KLMAG1REWF-B04P | HS400 | 11.5 x 13 x 1.0 mm | 16 GB | 1.8 / 3.3 V | -40 ~ 95 °C | Sample |
| KLMAG1REWF-B04Q | HS400 | 11.5 x 13 x 1.0 mm | 16 GB | 1.8 / 3.3 V | -40 ~ 105 °C | Sample |
| KLMAG2GEUF-B04P | HS400 | 11.5 x 13 x 0.8 mm | 16 GB | 1.8 / 3.3 V | -40 ~ 95 °C | Mass Production |
| KLMAG2GEUF-B04Q | HS400 | 11.5 x 13 x 0.8 mm | 16 GB | 1.8 / 3.3 V | -40 ~ 105 °C | Mass Production |
| KLMAG2GESD-B04P | HS400 | 11.5 x 13 x 0.8 mm | 16 GB | 1.8 / 3.3 V | -40 ~ 85 °C | EOL |
| KLMAG2GESD-B04Q | HS400 | 11.5 x 13 x 0.8 mm | 16 GB | 1.8 / 3.3 V | -40 ~ 105 °C | EOL |
| KLMBG1REWF-B04P | HS400 | 11.5 x 13 x 1.0 mm | 32 GB | 1.8 / 3.3 V | -40 ~ 95 °C | Mass Production |
| KLMBG1REWF-B04Q | HS400 | 11.5 x 13 x 1.0 mm | 32 GB | 1.8 / 3.3 V | -40 ~ 105 °C | Mass Production |
| KLMBG4GEUF-B04P | HS400 | 11.5 x 13 x 0.8 mm | 32 GB | 1.8 / 3.3 V | -40 ~ 95 °C | Mass Production |
| KLMBG4GEUF-B04Q | HS400 | 11.5 x 13 x 0.8 mm | 32 GB | 1.8 / 3.3 V | -40 ~ 105 °C | Mass Production |
| KLMBG4GESD-B04P | HS400 | 11.5 x 13 x 1.0 mm | 32 GB | 1.8 / 3.3 V | -40 ~ 85 °C | EOL |
| KLMBG4GESD-B04Q | HS400 | 11.5 x 13 x 1.0 mm | 32 GB | 1.8 / 3.3 V | -40 ~ 105 °C | EOL |
| KLMCG1REWF-B04P | HS400 | 11.5 x 13 x 1.0 mm | 64 GB | 1.8 / 3.3 V | -40 ~ 95 °C | Mass Production |
| KLMCG1REWF-B04Q | HS400 | 11.5 x 13 x 1.0 mm | 64 GB | 1.8 / 3.3 V | -40 ~ 105 °C | Mass Production |
| KLMCG4JEUD-B04P | HS400 | 11.5 x 13 x 1.2 mm | 64 GB | 1.8 / 3.3 V | -40 ~ 95 °C | Mass Production |
| KLMCG4JEUD-B04Q | HS400 | 11.5 x 13 x 1.2 mm | 64 GB | 1.8 / 3.3 V | -40 ~ 105 °C | Mass Production |
| KLMCG8GESD-B04P | HS400 | 11.5 x 13 x 1.0 mm | 64 GB | 1.8 / 3.3 V | -40 ~ 85 °C | EOL |
| KLMCG8GESD-B04Q | HS400 | 11.5 x 13 x 1.0 mm | 64 GB | 1.8 / 3.3 V | -40 ~ 105 °C | EOL |
| KLMDG2REWF-B04Q | HS400 | 11.5 x 13 x 1.2 mm | 128 GB | 1.8 / 3.3 V | -40 ~ 105 °C | Sample |
| KLMDG2REWF-B04P | HS400 | 11.5 x 13 x 1.2 mm | 128 GB | 1.8 / 3.3 V | -40 ~ 95 °C | Sample |
| KLMDG8JEUD-B04P | HS400 | 11.5 x 13 x 1.2 mm | 128 GB | 1.8 / 3.3 V | -40 ~ 95 °C | Mass Production |
| KLMDG8JEUD-B04Q | HS400 | 11.5 x 13 x 1.2 mm | 128 GB | 1.8 / 3.3 V | -40 ~ 105 °C | Mass Production |
| KLMEG4REWF-B04P | HS400 | 11.5 x 13 x 1.2 mm | 256 GB | 1.8 / 3.3 V | -40 ~ 95 °C | Sample |
| KLMEG4REWF-B04Q | HS400 | 11.5 x 13 x 1.2 mm | 256 GB | 1.8 / 3.3 V | -40 ~ 105 °C | Sample |